RELIFE RL-403C Lead-Free Solder Ball – Product Description

The RELIFE RL-403C Lead-Free Solder Ball is a professional-grade BGA reballing material designed for precision electronic repair, motherboard maintenance, and semiconductor chip rework. Manufactured for technicians and repair specialists, these high-quality solder balls provide reliable electrical connections and excellent soldering performance during BGA chip replacement and reballing operations. The product contains approximately 25,000 uniform solder balls with a 0.4 mm diameter, making it suitable for fine-pitch integrated circuits and modern mobile device motherboards.

Engineered with lead-free solder alloy technology, the RL-403C offers environmentally friendly performance while maintaining strong conductivity, consistent melting behavior, and durable solder joints. The solder balls are manufactured with strict diameter control to ensure uniform size, smooth surfaces, and accurate placement during rework processes. This precision helps reduce bridging, improves reballing accuracy, and increases repair success rates.

The solder balls are widely used for:

BGA chip reballing

Smartphone motherboard repair

CPU and GPU chip rework

IC replacement and repair

PCB manufacturing and maintenance

Electronic component assembly and servicing

Their smooth and consistent spherical shape promotes excellent wetting characteristics and stable solder joint formation. The lead-free composition is suitable for modern electronic devices that require RoHS-compliant soldering materials and dependable long-term performance.

Key Features

Professional BGA reballing solder balls

Lead-free, environmentally friendly alloy

Model: RL-403C

Ball diameter: 0.4 mm

Quantity: Approximately 25,000 pieces per bottle

Uniform size and high precision manufacturing

Smooth surface for improved soldering performance

Excellent electrical conductivity

Strong and reliable solder joints

Suitable for smartphone, tablet, computer, and PCB repairs

Ideal for repair shops, technicians, and electronics laboratories

Specifications

Brand: RELIFE

Model: RL-403C

Type: Lead-Free Solder Ball

Diameter: 0.4 mm

Quantity: 25,000 pcs/bottle

Application: BGA Reballing, IC Repair, PCB Soldering, Electronic Maintenance

Package Contents

1 × RELIFE RL-403C Lead-Free Solder Ball Bottle (25,000 pcs, 0.4 mm)

RELIFE products are widely recognized within the mobile repair industry, and technicians commonly use their soldering and rework materials for professional electronics servicing.