RELIFE RL-403C Lead-Free Solder Balls
KSh800
- RL-403C
- Lead-free “hardcover” solder
- Diameter: 0.4mm
- Approximately 25,000 spheres per bottle
RELIFE RL-403C Lead-Free Solder Balls, which are high-precision components used primarily for BGA (Ball Grid Array) reballing in smartphone and electronics repair.
Key Specifications
Model: RL-403C.Diameter: 0.4mm (as labeled on the bottle), with a strict tolerance of ≤8μm to ensure uniformity.Quantity: 25,000 pieces per bottle.Composition: Lead-free tin alloy, typically Sn96.5/Ag3.0/Cu0.5 (SAC305).Melting Point: Approximately 217°C–227°C, which is ideal for high-temperature resistant components.
Core Features & Applications
These solder balls are designed for professional-grade repairs, particularly for high-end devices like iPhones (“For iP” is noted on the label).
BGA Reballing: They serve as the connective material for re-attaching large chips, including the CPU, Power IC, and baseband chips, back onto a motherboard.Durability: The lead-free alloy provides higher mechanical strength and superior thermal fatigue resistance compared to traditional leaded options, ensuring long-lasting connections even under thermal stress.
MAECENAS IACULIS
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