MECHANIC 2 IN 1 Magnetic Levitation CPU Degumming / Tin Planting Platform

The MECHANIC 2 IN 1 Magnetic Levitation CPU Degumming / Tin Planting Platform is a professional-grade chip repair tool designed for technicians performing advanced motherboard and semiconductor rework. Engineered for precision and stability, this platform combines two essential repair functions in a single compact unit: CPU degumming (removal of adhesive, underfill, or bonding materials) and CPU tin planting (reballing and solder ball placement).

Featuring a magnetic levitation positioning system, the platform helps securely hold CPU and IC chips during delicate repair procedures, reducing movement and improving alignment accuracy. This enhances efficiency when working with high-density chip packages commonly found in smartphones, tablets, laptops, and other modern electronic devices.

The dual-function design eliminates the need for separate fixtures, allowing repair professionals to transition seamlessly between adhesive removal and solder reballing operations. Its precision-engineered structure supports consistent chip placement and helps minimize the risk of damage during maintenance and refurbishment tasks.

Built for electronics repair workshops, service centers, and chip-level technicians, the MECHANIC 2 IN 1 platform is an ideal solution for restoring damaged processors and integrated circuits. Whether performing motherboard repairs, chip replacement, reballing, or refurbishment work, the tool provides the stability, accuracy, and versatility required for professional results.

Key Features

Dual-function design for CPU degumming and tin planting.

Magnetic levitation platform for stable chip positioning.

Precision alignment for chip-level repair operations.

Suitable for CPU, IC, and BGA component servicing.

Improves efficiency and accuracy during rework procedures.

Compact and professional-grade construction.

Ideal for mobile phone, tablet, laptop, and motherboard repair.

Designed for electronics repair technicians and service centers.

Applications

CPU adhesive and underfill removal.

Chip reballing and solder ball planting.

Motherboard repair and refurbishment.

BGA and IC rework processes.

Mobile device and consumer electronics servicing.

Professional chip-level maintenance and restoration.