Mechanic Heat Kit air
KSh2,200
- Motherboard Layering
- Precision Repair Work
- Compatibility
- Temperature Range 20–260°C,
The module shown is part of the Mechanic Heat Kit (or Heat Air) series, which is an intelligent preheating platform system. These modules are engineered for “intelligent temperature control,” allowing technicians to safely heat mobile device motherboards without the need for traditional air guns or soldering irons.
- Motherboard Layering: Specifically used for separating and re-fitting double-layered iPhone motherboards.
- Precision Repair Work: Facilitates tasks such as IC chip BGA desoldering, tin planting (reballing), glue removal, and Face ID dot matrix repair.
- Compatibility: The module in the image appears to be specifically for the iPhone 13 series (13/13 mini/13 Pro/13 Pro Max), as indicated by the label on the bottom right.
- Modular Design: These platforms often feature interchangeable modules, making the system scalable for newer phone models like the iPhone 15 or 16.
- Uniform Heating: Designed with aluminum alloy panels to ensure even heat distribution across the surface, preventing component damage.
- Temperature Range: Typically operates within a range of 20–260°C, which is adjustable for different melting points.
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