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MECHANIC IPHONE UFO 11PCS Steel Stencil – Rounded Rectangle Hole BGA Reballing Template for IC Repair
KSh5,000
- 11-piece iPhone UFO steel stencil set designed for precise BGA reballing and IC repair.
- Features rounded rectangle hole technology for improved solder paste application and solder ball formation.
- Made from premium stainless steel for enhanced durability and long-term use.
- Provides high-precision alignment for accurate and reliable chip rework.
Description
The MECHANIC iPhone UFO 11PCS Steel Stencil Set is a professional-grade BGA reballing solution designed for precise IC repair and motherboard maintenance. Crafted from high-quality stainless steel, these durable stencils provide excellent accuracy and long-lasting performance for repeated repair applications.
Featuring a rounded rectangle hole design, the stencil set ensures even solder paste distribution and improved solder ball formation, helping technicians achieve reliable and consistent results. The 11-piece assortment supports various iPhone chip repair requirements, making it an essential tool for smartphone repair shops and electronics professionals.
Its lightweight, reusable construction allows for easy handling and efficient operation during rework processes. Whether used for chip reballing, motherboard restoration, or advanced electronic repairs, the MECHANIC iPhone UFO stencil set delivers precision and convenience for professional maintenance tasks.
Order MECHANIC IPHONE UFO 11PCS Steel Stencil – Rounded Rectangle Hole BGA Reballing Template for IC Repair from santaecommerce.com online shop in Kenya at an affordable price and it will be delivered to you.
Shipping and Delivery
MAECENAS IACULIS
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