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MECHANIC SAMSUNG 18PCS Steel Stencil – Rounded Rectangle Hole BGA Reballing Template for Samsung IC Repair
KSh5,000
- High-quality steel stencil designed for Samsung motherboard and IC repair.
- Features rounded rectangle hole design for precise solder ball placement.
- Includes 18 stencil pieces for multiple Samsung chip models.
- Made from durable stainless steel for long-lasting performance.
Description
The MECHANIC SAM 18PCS Steel Stencil – Rounded Rectangle Hole BGA Reballing Template for Samsung IC Repair is a precision repair tool designed for professional mobile phone technicians and electronics enthusiasts. Manufactured from high-quality stainless steel, this stencil set offers excellent durability, heat resistance, and long-lasting performance for repeated use.
Featuring a rounded rectangle hole design, the stencil ensures accurate solder paste application and consistent solder ball formation, helping improve the efficiency and quality of BGA chip reballing. The 18-piece set supports a wide range of Samsung IC repair applications, making it suitable for motherboard maintenance, chip rework, and advanced mobile device repairs.
Compact, lightweight, and easy to use, the MECHANIC SAM 18PCS Steel Stencil is an essential tool for repair shops and technicians seeking reliable and precise results in Samsung smartphone servicing
Order MECHANIC SAM 18PCS Steel Stencil – Rounded Rectangle Hole BGA Reballing Template for Samsung IC Repair from santaecommerce.com online shop in Kenya at an affordable price and it will be delivered to you.
Shipping and Delivery
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