The Mechanic XP7 148°C Soldering Paste is a professional-grade, mid-to-low temperature tin cream engineered specifically for high-end smartphone and communications hardware repair. It is heavily trusted by technicians for delicate micro-soldering tasks, especially on dual-layer or sandwiched motherboards.

• Optimized 148°C Melting Point: Prevents thermal damage to sensitive, heat-vulnerable micro-components on tightly packed circuit boards.
• Anti-Shift Stability: Features a moderate viscosity index (178 ± 10) that holds microscopic surface-mount devices (SMDs) and ball grid arrays (BGAs) firmly in place during reflow.
• Bright & Full Joints: Formulated to deliver high wettability and excellent weldability, resulting in full, shiny solder joints that resist cracking or false welding.
• No-Residue Formula: Leaves minimal, non-corrosive residue behind, keeping your PCB looking clean and eliminating the risk of internal circuit degradation.
  

• Layered Motherboard Repair: The go-to choice for separating and resoldering split-board architectures, including iPhone X, XR, XS, and newer smartphone motherboards.
• BGA Reballing: Ideal for reballing CPU, baseband, NAND, and power management integrated circuits (PMICs).
• Precision SMT/SMD Work: Perfect for fine-pitch component placement where precise, non-spreading solder application is critical.

• Brand: Mechanic
• Model: XP7 (X Series)
• Alloy Composition: Sn63 / Pb37 (Tin/Lead)
• Melting Point: 148°C
• Particle Size (Micron Range): 20 – 38 µm (Ultra-fine grain)
• Viscosity: 178 ± 10
• Net Weight: 60g and 42g
• Recommended Storage: 0 – 10°C for optimal 12-month shelf life