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Sn63/Pb37 183°C SMD Leaded Rework Soldering Flux Paste
KSh800
- Suitable for repair work
- Strong solder bond
- Has different alloys for better work
- Can be used in a variety of electronic components
Description
The Industry Standard for Micro-Soldering and BGA Reballing
Achieve professional-grade, defect-free solder joints with the Original Mechanic XGSP80 SMD Soldering Paste.Packed in a high-capacity 60g workshop jar, this high-performance leaded tin paste is the ultimate choice for smartphone motherboard repair, laptop logic board rework, and precise Surface Mount Technology (SMT) prototyping.
Engineered with an exact Sn63/Pb37 alloy ratio, the XGSP80 features a distinct eutectic melting point at 183°C (361°F). This allows the paste to transition instantly from liquid to solid, completely eliminating state-shifting movements that cause weak, cold, or fractured joints. Its excellent tackiness firmly holds microscopic components like IC chips, resistors, and capacitors in place before heat is applied.
Engineered with an exact Sn63/Pb37 alloy ratio, the XGSP80 features a distinct eutectic melting point at 183°C (361°F). This allows the paste to transition instantly from liquid to solid, completely eliminating state-shifting movements that cause weak, cold, or fractured joints. Its excellent tackiness firmly holds microscopic components like IC chips, resistors, and capacitors in place before heat is applied.
Key Technical Features
- Micro-Fine Type 4 Particles (20–38µm): Formulated with ultra-fine, perfectly spherical solder spheres. It glides effortlessly through fine-pitch stencils without clogging apertures or causing accidental solder bridges.
- Superior Wetting & Tinning Action: Instantly breaks through tough surface oxidation on copper and nickel pads upon contact with hot air, creating smooth, shiny, and highly conductive joints.
- Advanced IPX3 Rosin Flux Vehicle: Infused with a premium synthetic flux that provides robust thermal protection during reflow. It prevents the paste from burning, spitting, or separating mid-repair.
- Anti-Slump & Zero-Voiding: Holds its shape perfectly after stencil printing. It resists slumping under intense heat, ensuring zero microscopic air bubbles or structural gaps inside the final solder connection.
- No-Clean, Non-Corrosive Formula: Leaves behind a minimal, optically clear, non-conductive residue that will not corrode delicate circuit traces. While cleaning is optional, it easily wipes away with Isopropyl Alcohol (IPA).
Order SMD Soldering Paste- 60g from santaecommerce.com in Kenya and it will be delivered to you.
Shipping and Delivery
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